Fixture and method for securing electronic modules during wet pr

Details Fixture and method for securing electronic modules during wet pr Fixture and method for securing electronic modules during wet pr

1997-08-08

1999-06-22

Warden, Jill

Cleaning and liquid contact with solids

Processes

With treating fluid motion

134183, 134902, B08B 304, B08B 310

Patent

active

059139854

ABSTRACT:
A fixture for securing a circuit chip substrate having on one side solder connections during wet processing using a pulse jet delivery cleaning system for removing solder flux residue on the solder connections. The fixture comprises a frame of sufficient size to at least partially surround and contact the substrate on a first side and a lid cooperating with the frame to at least partially cover the substrate on a second side containing the solder connections. A resilient polymeric separator is disposed on the lid and faces the substrate for contacting the substrate second side containing the solder connections. There are also openings in the frame for permitting circulation of a cleaner to contact the second side of the substrate.

REFERENCES:
patent: 4767984 (1988-08-01), Bakker
patent: 4810616 (1989-03-01), Grabbe et al.
patent: 5106451 (1992-04-01), Kan et al.
patent: 5275690 (1994-01-01), Garwood, Jr.
patent: 5332463 (1994-07-01), Eberlein et al.
patent: 5465470 (1995-11-01), Vongfuangfoo et al.

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