Semiconductor device manufacturing: process – Making device array and selectively interconnecting – With electrical circuit layout
Patent
1995-10-30
1998-02-17
Bueker, Richard
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
With electrical circuit layout
437225, 118715, 118728, 118729, 118730, 225101, H01L 21203
Patent
active
057190771
ABSTRACT:
The invention is an apparatus and method for cleaving a semiconductor bar and coating the cleaved facets within a vacuum environment. The apparatus is a fixture having at least one rotator for cleaving one or more semiconductor samples into semiconductor bars and positioning the semiconductor bars for immediate coating of their cleaved facets. The fixture is operably positioned within a processing chamber and exposed to a conventional coating medium before, during or immediately after cleaving the semiconductor sample. The fixture cleaves the semiconductor samples in a manner that reduces semiconductor sample waste and also allows the processing environment requirements to be reduced compared to other cleaving and coating techniques. A single actuation feed-through mechanism actuates the fixture from outside of the processing chamber.
REFERENCES:
patent: 5063173 (1991-11-01), Gasser et al.
patent: 5144634 (1992-09-01), Gasser et al.
patent: 5154333 (1992-10-01), Bauer et al.
patent: 5171717 (1992-12-01), Broom et al.
Chakrabarti Utpal Kumar
de Jong Judith Francavilla
Schubert Erdmann Frederick
Wynn James Dennis
Zydzik George John
Bueker Richard
Harman John M.
Lucent Technologies - Inc.
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