Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1991-06-28
1993-08-31
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
100 93P, 100237, 100266, 156312, 156382, B30B 702, B30B 1534
Patent
active
052405494
ABSTRACT:
A fixture (10) for bonding multiple components together includes a bottom plate (20), a middle plate (22) and a top plate (24). The plates (20), (22) and (24) are aligned by dowels (26) and clamps (30). Bottom plate (20) has a rectangular pocket (32) for holding heat sink (14) and alignment pins (34) for locating plastic pin grid array (PPGA) package (12) over the heat sink (14). An annular projection (40) covered with a conformal pad (42) extends from bottom surface (44) of the middle plate (22). Dowel (50) extends through openings (46) and (36) in the top and middle plates (24) and (22) to apply pressure to chip (16). A first spring (56) is mounted on the dowel (50) and compressed between the top plate (24) and a snap ring (58) to provide pressure from the dowel (50) on the chip (16). A second, larger diameter spring (60) is compressed between the middle plate (22) and the top plate (24) to provide pressure from the middle plate (22) on the PPGA (12). Cartridge heaters (62) are embedded in the bottom plate (20) to provide heat for epoxy or solder bonding. A thermocouple (64) monitors temperature at the bottom plate (20).
REFERENCES:
patent: 2746514 (1956-05-01), Warnken
patent: 3067309 (1962-12-01), Chinn
patent: 3669333 (1972-06-01), Coucoules
patent: 4161569 (1979-06-01), Faber
patent: 4648934 (1987-03-01), Kiss
patent: 4900390 (1990-02-01), Colton
patent: 4968376 (1990-11-01), Shimada
patent: 5076880 (1991-12-01), Spengler
patent: 5106451 (1992-04-01), Kan
Fitch John S.
Hamburgen William
Ball Michael W.
Digital Equipment Corporation
Stemmer Daniel J.
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