Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-06-30
1995-08-29
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156299, 156312, 156323, H01L 21447, H01L 21603, B32B 3120
Patent
active
054456975
ABSTRACT:
A fixture (10) for bonding multiple components together includes a bottom plate (20), a middle plate (22) and a top plate (24). The plates (20), (22) and (24) are aligned by dowels (26) and clamps (30). Bottom plate (20) has a rectangular pocket (32) for holding heat sink (14) and alignment pins (34) for locating plastic pin grid array (PPGA) package (12) over the heat sink (14). An annular projection (40 ) covered with a conformal pad (42) extends from bottom surface (44) of the middle plate (22). Dowel (50) extends through openings (46) and (36) in the top and middle plates (24) and (22) to apply pressure to chip (16). A first spring (56) is mounted on the dowel (50) and compressed between the top plate (24) and a snap ring (58) to provide pressure from the dowel (50 ) on the chip (16). A second, larger diameter spring (60) is compressed between the middle plate (22) and the top plate (24) to provide pressure from the middle plate (22) on the PPGA (12). Cartridge heaters (62) are embedded in the bottom plate (20) to provide heat for epoxy or solder bonding. A thermocouple (64) monitors temperature at the bottom plate (20).
REFERENCES:
patent: 3669333 (1972-06-01), Coucoulas
patent: 4161569 (1979-07-01), Faber
patent: 4795517 (1989-01-01), Elliot
patent: 4900390 (1990-02-01), Colton
patent: 4968376 (1990-11-01), Shimada
patent: 5106451 (1992-04-01), Kan
Fitch John S.
Hamburgen William R.
Ball Michael W.
Digital Equipment Corporation
Fisher Arthur W.
Maloney Denis G.
Ross Gary
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