Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1990-05-14
1991-06-18
Tufariello, T. M.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C25D 1706
Patent
active
050247468
ABSTRACT:
This disclosure describes a plating fixture to hold a silicon wafer containing integrated circuits in a metal plating bath. The wafer is coated with photoresist to a thickness equal to the desired bump height and the desired bump locations patterened by standard photolithographic techniques. The wafer is then loaded in the fixture and the fixture placed in the plating bath so that the patterned side of the wafer is facing up and the plating anode is located directly above the wafer. Systems presently on the market have the wafer positioned with the patterned side facing down and the anode located below it, or the wafer faces sideways and the anodes are access from it. These present systems allow air to be entrapped in the pattern of the photoresist, lowering yield by under plating or uneven plating of the bumps on the wafer. This disclosure prevents such yield loss and also allows cleanups on the wafer after it is loaded in the fixture.
REFERENCES:
patent: 2362228 (1944-11-01), Wright
patent: 3536594 (1970-10-01), Pritchard
Lessard Robert J.
Stierman Roger J.
Barndt B. Peter
Comfort James T.
Sharp Melvin
Texas Instruments Incorporated
Tufariello T. M.
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