Fixing structure of fixing a thermal module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S704000, C361S709000, C361S700000, C361S679520, C165S080400, C165S080500, C165S185000, C165S104330, C257S718000, C257S719000, C174S016300, C024S458000, C024S459000, C024S520000

Reexamination Certificate

active

07903420

ABSTRACT:
A fixing structure for fixing a thermal module on a chip of a printed circuit board is provided. The printed circuit board has a plurality of studs and a positioning post. The fixing structure includes a fixing board. The fixing board has a plurality of elastic strips, a plurality of screw holes and a spacing hole. The screw holes are on the elastic strips respectively, and the spacing hole is located close to one of the screw holes. The fixing board is positioned in the studs and the positioning post via the screw holes and the spacing hole, so that the fixing board can be fixed on the thermal module and chip.

REFERENCES:
patent: 6331937 (2001-12-01), Bartyzel
patent: 6646881 (2003-11-01), Lai et al.
patent: 2004/0001316 (2004-01-01), Kamikawa et al.
patent: 2006/0007659 (2006-01-01), Lee et al.
patent: 2007/0091576 (2007-04-01), Wung et al.
patent: 1397998 (2003-02-01), None
patent: 584218 (2004-04-01), None
patent: M261007 (2005-04-01), None
English language translation of abstract of CN 1397998.
English language translation of abstract of CN 1397998, Mar. 21, 2008.
English language translation of abstract of TW 584218 (published Apr. 11, 2004).
English language translation of abstract of TW M261007 (published Apr. 1, 2005).

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