Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2000-09-29
2002-05-28
Lee, Eddie (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S667000, C257S668000, C257S673000, C257S676000, C228S180210, C228S180220, C029S025010, C269S021000
Reexamination Certificate
active
06396128
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a fixing structure and a fixing method for fixing a semiconductor integrated circuit apparatus on a print wiring board while electrically connecting lead terminals of the semiconductor integrated circuit apparatus with pads of the print wiring board.
2. Description of Related Art
In a conventional method for mounting a semiconductor integrated circuit apparatus on a print wiring board, a socket having a plurality of electrical contact portions is prepared for a semiconductor integrated circuit apparatus, and each of a plurality of external connecting terminals of the semiconductor integrated circuit apparatus is connected with the corresponding electrical contact portion of the socket. Thereafter, the semiconductor integrated circuit apparatus is mounted on a print wiring board through the socket while being electrically connected with the print wiring board.
A conventional fixing structure for fixing the semiconductor integrated circuit apparatus on the print wiring board by using a conventional fixing method is described.
A cap is put on the semiconductor integrated circuit apparatus, which is mounted on the print wiring board, from the same direction as a mounting direction of the semiconductor integrated circuit apparatus, and four corners of the cap are screwed down so as to press the external connecting terminals of the semiconductor integrated circuit apparatus on the electrical contact portions of the socket. Therefore, the external connecting terminals of the semiconductor integrated circuit apparatus are tightly connected with the electrical contact portions of the socket, and the semiconductor integrated circuit apparatus is fixed on the print wiring board.
Also, in another conventional fixing structure using a conventional fixing method, after each external connecting terminal of the semiconductor integrated circuit apparatus is connected with the corresponding electrical contact portion of the socket, a cap is put on the semiconductor integrated circuit apparatus, and the cap and the semiconductor integrated circuit apparatus are pushed down toward the print wiring board in the same direction as a mounting direction of the semiconductor integrated circuit apparatus, while moving the cap by using a lever operated according to a cam mechanism, so as to press each external connecting terminal of the semiconductor integrated circuit apparatus on the corresponding electrical contact portion of the socket. Therefore, the external connecting terminals of the semiconductor integrated circuit apparatus are tightly connected with the electrical contact portions of the socket, and the semiconductor integrated circuit apparatus is fixed on the print wiring board.
However, because each external connecting terminal of the semiconductor integrated circuit apparatus is fixed on the print wiring board by using the conventional fixing structure for the semiconductor integrated circuit apparatus, the electrical contact portion of the socket is located between the external connecting terminal of the semiconductor integrated circuit apparatus and a wiring portion of the print wiring board. Therefore, a response time in the operation performed in the semiconductor integrated circuit apparatus is delayed by a contact capacitance of the electrical contact portion, and there is a problem that the performance of the semiconductor integrated circuit apparatus is adversely affected.
Also, in cases where the semiconductor integrated circuit apparatus is repeatedly used, the electrical contact portion of the socket may be deformed, or the cap may not be correctly fixed at a prescribed position. In this case, there is a problem that the external connecting terminal of the semiconductor integrated circuit apparatus is not connected with the electrical contact portion of the socket.
Also, the socket is soldered to the print wiring board to arrange the socket on the print wiring board. Therefore, in cases where the electrical contact portion of the socket is deformed, there is a problem that it is difficult to replace the socket with a new socket when the electrical contact portion of the socket is deformed.
Also, because the number of socket terminals respectively soldered to the print wiring board corresponds to the number of external connecting terminals of the semiconductor integrated circuit apparatus, it is required to perform the soldering of the socket terminal to the print wiring board many times. Therefore, there is a problem that it takes a lot of time to connect the socket with the print wiring board.
Also, because the number of external connecting terminals of a semiconductor integrated circuit apparatus and the shape of the external connecting terminals depend on a type of the semiconductor integrated circuit apparatus, various types of sockets respectively matching with one type of semiconductor integrated circuit apparatus are required. Therefore, there is a problem that the fixing structure cannot be prepared at a low cost.
SUMMARY OF THE INVENTION
An object of the present invention is to provide, with due consideration to the drawbacks of the conventional fixing structure and the conventional fixing method for the semiconductor integrated circuit apparatus, a fixing structure and a fixing method for a semiconductor integrated circuit apparatus in which the semiconductor integrated circuit apparatus is easily and reliably fixed on a print wiring board at a low cost, without delaying a response time in the operation of the semiconductor integrated circuit apparatus, while electrically connecting the semiconductor integrated circuit apparatus with the print wiring board.
The object is achieved by the provision of a fixing structure for a semiconductor integrated circuit apparatus, in which a semiconductor integrated circuit apparatus is fixed on a print wiring board, comprising:
a hole portion arranged in the print wiring board; and
suction and fixing means for suctioning the semiconductor integrated circuit apparatus through the hole portion to press an external connecting terminal of the semiconductor integrated circuit apparatus on a wiring portion of the print wiring board and fixing the semiconductor integrated circuit apparatus on the print wiring board.
Also, the object is achieved by the provision of a fixing method for a semiconductor integrated circuit apparatus, comprising the steps of:
preparing a hole portion arranged in a print wiring board;
suctioning a semiconductor integrated circuit apparatus through the hole portion so as to press an external connecting terminal of the semiconductor integrated circuit apparatus on a wiring portion of the print wiring board; and
fixing the semiconductor integrated circuit apparatus on the print wiring board.
In the above configuration and steps, because the suction and fixing means suctions the semiconductor integrated circuit apparatus through the hole portion, the semiconductor integrated circuit apparatus is drawn toward the print wiring board. Therefore, the external connecting terminal of the semiconductor integrated circuit apparatus is pressed on the wiring portion of the print wiring board by suction.
Accordingly, the semiconductor integrated circuit apparatus can be easily and reliably fixed on the print wiring board at a low cost regardless of a type of the semiconductor integrated circuit apparatus.
Also, because no electrical contact portion exists between the external connecting terminal of the semiconductor integrated circuit apparatus and the wiring portion of the print wiring board, there is no probability that a response time in the operation of the semiconductor integrated circuit apparatus is delayed by a contact capacitance of an electrical contact portion.
Also, because no electrical contact portion is used in the fixing structure, the fixing structure can be simplified. Therefore, the fixing structure can be easily manufactured. Also, even though the semiconductor integrated circuit apparatus is fixed on the print wiring bo
Burns Doane , Swecker, Mathis LLP
Chu Chris
Lee Eddie
Mitsubishi Denki & Kabushiki Kaisha
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