Fixed-abrasive chemical-mechanical planarization of titanium...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S060000, C051S293000

Reexamination Certificate

active

07402094

ABSTRACT:
Planarizing solutions, and their methods of use, for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution or an oxidizing solution. The etchant solutions are aqueous solutions containing an etchant and a buffer. The etchant contains one or more etching agents selective to titanium nitride. The oxidizing solutions are aqueous solutions containing an oxidizer and a buffer. The oxidizer contains one or more oxidizing agents selective to titanium nitride. In either solution, i.e., etchant or oxidizing solution, the buffer contains one or more buffering agents. Titanium nitride layers planarized in accordance with the invention may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits.

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Printout of MSDS Material Safety Data Sheet from Mallinckrodt Baker, Inc. 222 Red School Lane, Phillipeburg, NJ 08865 titled “Ascorbic Acid”.

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