Fitting substrate for connection and fitting substrate for...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S796000, C710S100000

Reexamination Certificate

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07042735

ABSTRACT:
The invention efficiently mounts substrates to back planes and accomplishes high quality signal transfer. Connectors to which N adaptor substrates are fitted and connectors to which M bus switch substrates are fitted are provided to a multi-layered back plane. Signal pin groups of the connector on the adaptor substrate side are grouped into M data paths. Signal pins of the connector on the adaptor substrate side and corresponding signal pins of the connector on the bus switch substrate side are arranged horizontally in such a fashion as to exist on the same plane (with positions in a Z direction being substantially equal). Therefore, wiring patterns for connecting corresponding signal pins can be formed substantially linearly and a large number of substrates can be efficiently mounted to a limited area.

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patent: 6392142 (2002-05-01), Uzuka et al.
patent: 6917998 (2005-07-01), Giles
patent: 2002/0074670 (2002-06-01), Suga
patent: 2004/0090758 (2004-05-01), Horikawa
patent: 11-312854 (1999-11-01), None

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