Fitting process for packaging a semiconductor component in a pla

Details Fitting process for packaging a semiconductor component in a pla Fitting process for packaging a semiconductor component in a pla

1988-02-25

1989-08-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

361417, 174 521, 29832, 357 72, 437218, H01L 2348

Patent

active

048596310

ABSTRACT:
The invention relates to the encapsulation of a seminconductor component in a plastic box.
The fitting assembly comprises a radiator plate, a ceramic plate, a copper counter-electrode, a semiconductor pellet, a connecting pin with its end bent back and welded to the counter-electrode, whereby the latter is much larger than the pellet and occupies almost the entire surface of the ceramic plate. The ends of the other connecitng pins are bent back above the metallized zones of the upper pellet surface. Fiting takes place in a positioner machined in the form of successive cups with decreasing dimensions, in order to produce a welded stack having all the above elements, except the connecting pins, which are subsequently welded to the stack once the latter has been extracted from the positioner.

REFERENCES:
patent: 3522490 (1970-08-01), Kauffman
patent: 3569797 (1971-03-01), Simmons
patent: 3628101 (1971-12-01), Kennedy
patent: 3763403 (1973-10-01), Lootens
patent: 4346396 (1982-08-01), Carroll, II et al.

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