Fitted endpoint system

Details Fitted endpoint system Fitted endpoint system

1998-06-23

1999-10-12

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

H01L 21306

Patent

active

059649801

ABSTRACT:
A processor is provided for an improved semiconductor etching system which generates a series of multi-bit digital output code words. The processor provides an endpoint detector for determining if one of the digital output code word has reached a predetermined endpoint level and for generating a control signal to stop etching of a wafer. The processor further provides a standard endpoint curve corresponding to standard etching of a standard wafer. A normalizer is provided for normalizing the current endpoint curve generated from the series of multi-bit digital code words for a wafer being etched with respect to the standard endpoint curve and for providing a normalized current endpoint curve. A comparator fits and compares the normalized current endpoint curve for a wafer being etched to the standard endpoint curve, where the comparator includes a generator for generating a quality index number for the wafer corresponding to the cumulative area between the normalized current endpoint curve for a wafer being etched and the standard endpoint curve.

REFERENCES:
patent: 4479848 (1984-10-01), Otsubo et al.
patent: 5160402 (1992-11-01), Cheng
patent: 5467883 (1995-11-01), Frye et al.

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