Firing process for forming a multilayer glass-metal module

Details Firing process for forming a multilayer glass-metal module Firing process for forming a multilayer glass-metal module

1971-08-27

1976-07-06

Arnold, Donald J.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264104, C04B 3704, C04B 3702

Patent

active

039681939

ABSTRACT:
A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.

REFERENCES:
patent: 2038627 (1936-04-01), Badger
patent: 3340602 (1967-09-01), Hontz
patent: 3349474 (1967-10-01), Rauscher
patent: 3423517 (1969-01-01), Arrhenius
patent: 3520054 (1970-07-01), Pensack et al.
patent: 3523357 (1970-08-01), Meyer
patent: 3528169 (1970-09-01), Perrin et al.
patent: 3666613 (1972-05-01), Beninga
NASA Technical Note D-5320, "A Fabrication Process for Glass Coated Electron-Bombardment Ion Thruster Grids," Bruce Banks, July, 1969.
Solid State Transmission Lines, B. Greenstein et al., vol. 13, No. 4, Sept. 1970, IBM Tech. Disclosure Bull. p. 960.
Bubble-Free Glass Films, IBM, Tech. Disclosure Bulletin vol. 13, No. 4, Sept. 1970, p. 961 Turetsky.

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