Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate
2007-02-28
2009-06-02
Speer, Timothy M (Department: 1794)
Stock material or miscellaneous articles
Composite
Of silicon containing
C134S003000, C156S345150, C156S345120, C216S031000, C216S052000, C216S083000, C216S088000, C438S905000
Reexamination Certificate
active
07541094
ABSTRACT:
Described are methods and chemistries for preparing firepolished quartz parts for use in semiconductor processing. The quartz parts in need of preparation include newly manufactured parts as well as parts requiring refurbishment after previous use in semiconductor processing. The embodiments described avoid methods and chemistries that may damage the surfaces of the quartz parts and render the parts unfit for use in semiconductor processing. A method in accordance with one embodiment minimizes damage by limiting exposure of the quartz parts to hydrofluoric acid. A quartz part for use in semiconductor processing comprises a surface including a surface portion having a surface portion area to expose to a gas, wherein at least 95 percent of the surface portion area is free of defects and wherein the surface portion has less than E12 atoms per centimeter squared of aluminum.
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Japanese Machine translation of JP 2008-031038 provided by the JPO website. Translation date of Jan. 4, 2009.
Liang, Da-Tung et al., “Dissolution Kinetics of Crystalline and Amorphous Silica in Hydrofluoric-Hydrochloric Acid Mixtures.” Journal of American Ceramic Society, vol. 70, No. 8, pp. 570-577, 1987.
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Leggett Gregory H.
Zuck David S.
Behiel Arthur J.
Langman Jonathan C
Lauer Joyce
Quantum Global Technologies, LLC
Silicon Edge Law Group LLP
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