Fingerprint sensor package including flexible circuit...

Image analysis – Applications – Personnel identification

Reexamination Certificate

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Reexamination Certificate

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06950541

ABSTRACT:
A fingerprint sensor package preferably includes a fingerprint sensing integrated circuit in a housing, and a circuit substrate comprising first and second portions connected together. The first portion is within the housing and mounts the fingerprint sensing integrated circuit, and the second portion is flexible and extends outwardly from the housing for facilitating electrical connection to the fingerprint sensing integrated circuit from external to the housing. Each portion of the circuit substrate preferably includes at least one insulating layer and at least one electrical conductor thereon. Accordingly, the package can be made relatively compact and electrical interconnections are facilitated by the second portion or extension of the circuit substrate. In one embodiment, the first and second portions are integrally formed together. In this embodiment, the first portion is also flexible. The sensor package is readily included on the upper surface of a laptop computer, for example.

REFERENCES:
patent: 5657012 (1997-08-01), Tait
patent: 5862248 (1999-01-01), Salatino et al.
patent: 6333989 (2001-12-01), Borza
patent: WO/98/11500 (1998-03-01), None

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