Fingerprint sensor and interconnect

Details Fingerprint sensor and interconnect Fingerprint sensor and interconnect

2005-08-02

2005-08-02

Luu, Thanh X. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

C250S239000, C361S760000

Reexamination Certificate

active

06924496

ABSTRACT:
Flexible interconnect packaging system. The system includes a flexible substrate material that includes internal traces coupled to fingerprint sensor mounted to the substrate. Bonding pads of the fingerprint sensor are connected to conductive trace pads of the internal traces using techniques such as, wire bonding, ball/bump methods, tape automated bonding (TAB), or any other applicable bonding methodology for integrated circuits. The final package includes a pre-molded package the forms an open cavity, thereby allowing a sensor surface of the fingerprint sensor to be exposed for access by a user.

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patent: WO 99/60513 (1999-11-01), None
patent: WO-01-75962 (2001-10-01), None

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