Fingerprint sensor and fabrication method thereof

Details Fingerprint sensor and fabrication method thereof Fingerprint sensor and fabrication method thereof

2004-08-30

2008-07-15

Tran, Phuoc (Department: 2624)

Image analysis

Applications

Personnel identification

C073S620000

Reexamination Certificate

active

07400750

ABSTRACT:
Provided are a fingerprint sensor and a fabrication method thereof. The fingerprint sensor includes: a complementary metal-oxide semiconductor structure which is formed on a substrate that is doped with a first type dopant; an insulating layer which is formed on the complementary metal-oxide semiconductor structure; a lower electrode which is formed in a central portion of the insulating layer; a piezoelectric region which is formed on the lower electrode; an upper electrode which is formed on the piezoelectric layer; and a fingerprint contact layer which is formed to cover a portion of an upper surface of the insulating layer on which the lower electrode has not been formed, the lower electrode, the piezoelectric region, and the upper electrode.

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B. Charlot et al., “A Sweeping Mode Integrated Tactile Fingerprint Sensor”, Proceedings of the 12thInternational Conference on Solidstate Sensors, Actuators, and Microsystems, Boston, Jun. 8-12, 2003, vol. 2, pp. 1031-1034.
European Patent Office Search Report.

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