Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-03-19
2009-12-08
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S931000, C257SE21054, C257SE21128
Reexamination Certificate
active
07629200
ABSTRACT:
A fingerprint detection device has a fingerprint sensor chip and a diamond-like carbon (DLC) film covering the outermost surface of the sensor chip. The DLC film provides sufficient strength and enhanced electrostatic discharge withstand voltage to the fingerprint sensor chip. Thus, the DLC film protects the fingerprint sensor chip without any conventional protective cover. The DLC film is less scratchable and less stainable. Since the fingerprint detection device has no protective cover, the device can be provided in a thin and compact form. In addition, the device has high reliability.
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Miyai Seiichi
Oka Shuichi
Depke Robert J.
Nhu David
Rockey Depke & Lyons, LLC
Sony Corporation
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