Finger pattern formation for thin film solar cells

Details Finger pattern formation for thin film solar cells Finger pattern formation for thin film solar cells

2008-01-22

2011-11-29

Goff, II, John (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S261000, C438S098000, C136S256000

Reexamination Certificate

active

08066840

ABSTRACT:
A method of forming metallic connector patterns for solar cells, whereby an embosser having raised features shaped in the form of a metallic connector pattern is used to attach a portion of a metallic foil to a transparent conductive layer formed on a top transparent surface of a solar cell structure. The raised surfaces of the embosser press the metallic foil portion against the transparent conductive layer. Heat and pressure directed to the metallic foil portion attach the metallic foil portion to the underlying transparent conductive layer, and then the rest of the metallic foil, which is not attached to the transparent conductive layer, is removed.

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