Fine wire of gold alloy, method for manufacture thereof and use

Details Fine wire of gold alloy, method for manufacture thereof and use Fine wire of gold alloy, method for manufacture thereof and use

1998-07-06

2000-08-15

Sheehan, John

Metal treatment

Stock

Noble metal base

420508, 420509, 420510, C22C 500

Patent

active

061030252

ABSTRACT:
Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.

REFERENCES:
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patent: 4938923 (1990-07-01), Kujiraoka et al.
patent: 5702814 (1997-12-01), Hanada et al.
patent: 5989364 (1999-11-01), Kitamura
Chemical Abstracts, vol. 121, (1994) No. 89287 of JP 6-112258A.
Patent Abstracts of Japan, vol. 1997, No. 03, Mar. 31, 1997 & JP 08 293516 A (Nippon Steel Corp) , Nov. 5, 1996.
Patent Abstracts od Japan, vol. 1997, No. 03, Mar. 31, 1997 & JP 08 291348 A (Nippon Steel Copr) , Nov. 5, 1996.
Patent Abstracts of Japan, vol. 1997, vol. 1997, No. 03, March 31, 1997 & JP 08 293514 A (Nippon Steel Copr) , Nov. 5, 1996.

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