Fine polishing composition for wafers

Details Fine polishing composition for wafers Fine polishing composition for wafers

1988-12-29

1991-01-08

Cashion, Jr., Merrell C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524 30, 524 35, 524 47, 524442, 523443, 527312, C08K 336, C08K 520, C08K 710, C08G 5952

Patent

active

049836501

ABSTRACT:
A fine polishing composition for wafers, comprising water, particulate amorphous silica and a polysaccharide polymer graft-polymerized with acrylamide alone or together with at least one vinyl monomer selected from the group consisting of acrylic acid, methacrylic acid and styrenesulfonic acid, and adjusted with an alkaline substance to a pH of from 8 to 12.

REFERENCES:
patent: 4260396 (1981-04-01), Glemza

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