Fine pitch leaded component placement process

Details Fine pitch leaded component placement process Fine pitch leaded component placement process

1991-01-29

1992-03-24

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228159, 228 62, B23K 3102

Patent

active

050980084

ABSTRACT:
A method of mounting an integrated circuit carrier (10) having a plurality of straight leads (12) retained by an integral frame (16) is provided. The plurality of straight leads (12) of the carrier (10) is bent to form a plurality of bent leads (12) still retained by the frame (16). The plurality of bent leads are then scored to form a notch (32) on each bent lead. Solder fluxing, placing, and reflowing the plurality of bent leads of the integrated circuit carrier against corresponding printed lines of the printed circuit (26) surface before each notch follow. Finally, a remainder portion of the plurality of leads from and including the frame (16) to the notch (32) on each lead (12) is removed.

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