Fine pitch electronic component placement method and apparatus

Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...

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228 495, 228 62, H05K 334

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active

055269745

ABSTRACT:
A method and kit for precisely placing fine pitch surface-mount electronic components onto printed circuit boards. An alignment substrate having a pattern of solder pads and holes or transverse edges corresponding to the pattern of solder pads and holes or edges on a printed circuit board is secured to a base by registration pins fastened to the base and inserted into contact with said holes or edges. Generally, the alignment substrate is preferably another circuit board identical with the board to be bonded to the electrical component. A template having a pattern of recesses corresponding to the component lead pattern is secured over the alignment substrate. A component is placed on the template with leads in the recesses. The component is lifted away, a printed circuit board is placed over the template and the component is lower onto the board. The board with component in place can then be removed for soldering.

REFERENCES:
patent: 3574934 (1971-04-01), De Rose
patent: 3831250 (1974-08-01), Holiday
patent: 4512509 (1985-04-01), Ellis, Jr. et al.
patent: 4595794 (1986-06-01), Wasserman
patent: 4985107 (1991-01-01), Conroy et al.

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