Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2005-08-23
2005-08-23
Sarkar, Asok Kumar (Department: 2829)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
C438S613000, C438S666000, C438S674000, C438S676000
Reexamination Certificate
active
06933216
ABSTRACT:
After a barrier film is formed on a pad electrode, Ni particles having a diameter of 2 μm or less are selectively deposited on the barrier film, thereby forming a Ni fine particle film. Then, a bump electrode made of a solder ball is provided on the pad electrode through the Ni fine particle film. Thereafter, the bump electrode is melted by a heat treatment to join the Ni fine particle film to the bump electrode. Thus, a bump electrode structure is finished.
REFERENCES:
patent: 5147413 (1992-09-01), Kiovsky et al.
patent: 5324552 (1994-06-01), Opower et al.
patent: 5529634 (1996-06-01), Miyata et al.
patent: 5629564 (1997-05-01), Nye, II et al.
patent: 5631499 (1997-05-01), Hosomi et al.
patent: 5648686 (1997-07-01), Hirano et al.
patent: 5864178 (1999-01-01), Yamada et al.
patent: 5903058 (1999-05-01), Akram
patent: 5912510 (1999-06-01), Hwang et al.
patent: 5925931 (1999-07-01), Yamamoto
patent: 5943597 (1999-08-01), Kleffner et al.
patent: 5959363 (1999-09-01), Yamada et al.
patent: 5962918 (1999-10-01), Kimura
patent: 5998861 (1999-12-01), Hiruta
patent: 6008543 (1999-12-01), Iwabuchi
patent: 6028357 (2000-02-01), Moriyama
patent: 6051450 (2000-04-01), Ohsawa et al.
patent: 6111317 (2000-08-01), Okada et al.
patent: 6111321 (2000-08-01), Agarwala
patent: 6127736 (2000-10-01), Akram
patent: 5-47771 (1993-02-01), None
patent: 6-280002 (1994-10-01), None
patent: 10183328 (1998-07-01), None
IBM Technical Disclosure, “Premagnetizing Magnetic Data,” Oct. 1, 1985.
Hayasaka Nobuo
Nishino Hirotaka
Okumura Katsuya
Sakata Atsuko
Sasaki Keiichi
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Sarkar Asok Kumar
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