Fine line repair technique

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29575, 250492B, 219121LM, 427 88, 427 89, 427140, 427142, 430314, 430317, H01L 2128

Patent

active

042593670

ABSTRACT:
Repair of opens and shorts in semiconductor packages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulating layer.

REFERENCES:
patent: 3506506 (1970-04-01), Pennebaken
patent: 3539880 (1970-11-01), Squire et al.
patent: 3559281 (1971-02-01), Mayberry et al.
patent: 3597834 (1971-08-01), Lathrop et al.
patent: 3705047 (1972-12-01), Marriott
patent: 3861023 (1975-01-01), Bennett
patent: 3923567 (1975-12-01), Lawrence

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fine line repair technique does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fine line repair technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fine line repair technique will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2243301

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.