Fine electroforming mold and manufacturing method thereof

Details Fine electroforming mold and manufacturing method thereof Fine electroforming mold and manufacturing method thereof

2007-09-11

2007-09-11

Bell, Bruce F. (Department: 1746)

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Mold, mask, or masterform

C205S050000, C205S067000, C205S075000, C205S076000, C205S078000, C204S281000

Reexamination Certificate

active

10503496

ABSTRACT:
The present invention provides a mold for fine electroforming M having a simple structure. In order to improve the productivity of a metal product, an electrode portion can be arranged with a much higher density, and a metal thin film formed on the electrode portion can easily be peeled off. The present invention provides a manufacturing method for manufacturing the mold M with a higher accuracy and by an easier way.The mold for fine electroforming M has a conductive substrate1to function as a cathode during electroforming and insulation layer2having an opening21, which has a shape corresponding to a shape of a plane shape of the metal product P and is through to the conductive substrate1, and composed of an inorganic insulation material having a thickness T2of not less than 10 nm and less than one-half the thickness T1of the metal product P. The surface of the conductive substrate1exposed at the opening21is adapted to serve as the electrode portion.The manufacturing method of the mold M has steps of: forming an inorganic thin film2′ to grow into the insulation layer2in an area excluding an area, where resist film R is pattern-formed, on the surface of the conductive substrate1; and removing the resist film R to form the opening21.

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