Fin device for an integrated circuit

Heat exchange – With retainer for removable article – Electrical component

Patent

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Details

165121, 165185, 361697, 24563, 2483167, H01L 2340

Patent

active

052996328

ABSTRACT:
A fin device includes a plate having a bottom surface for contacting an upper surface of an integrated circuit and an upper surface from which two opposite end walls extend upward. A plurality of rows of fins extend between the opposite end walls and extend upward from the upper surface of the plate. A substantially L-shaped member extends outward and upward from each fin of first and last rows which are adjacent to and extend parallel to the opposite end walls. Each L-shaped member extends to a height above the fins. The fins of the first and last rows respectively define a groove with associated adjacent end walls for receiving at least one snapping fastener. Each snapping fastener is substantially T-shaped, including a substantially inverted L-shaped portion with a distal snapping head at an end thereof and two arms extending laterally from the other end thereof. The arms have a recessed portion at an underside thereof. The distal snapping head releasably engages with a bottom surface of the integrated circuit to retain a reliable contact of the bottom surface of the plate and the upper surface of the integrated circuit. A fan is securely mounted on the L-shaped members in which a space is defined between the fins and the fan to increase the effect of heat dissipation.

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