Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Reexamination Certificate
1998-05-29
2001-04-24
Hampton-Hightower, P. (Department: 1711)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From carboxylic acid or derivative thereof
C528S125000, C528S128000, C528S172000, C528S173000, C528S179000, C528S188000, C528S220000, C528S229000, C528S350000, C428S395000, C428S411100, C428S473500, C264S045100, C264S165000, C264S170000, C264S171100, C264S171210, C264S331110, C264S331120, C264S331210
Reexamination Certificate
active
06222007
ABSTRACT:
BACKGROUND OF THE INVENTION
Polyimides are heterocyclic polymers commonly synthesized by the condensation reaction of aromatic diamines with aromatic dianhydrides, or derivatives thereof, in various solvents. The initial reaction between the diamine and the dianhydride yields a polyamic acid which upon heating imidizes to the polyimide. A schematic of the synthetic process is given in FIG.
1
. These materials exhibit a variety of desirable properties such as high temperature and solvent resistance, high modulus, and improved flow for better wetting and bonding in the fabrication of composites. These advantageous properties of polyimides have lead to their use as matrix resins, molding powders and films. In addition, high performance polyimides are used in the aerospace industry, for example, in the manufacture of lighter and stronger aircraft and space structures as well as in joining metals to metals, or metals to composite structures.
The synthesis and characterization of polyimides has been extensively studied and documented. Reviews on polyimides are available [J. W. Verbicky, Jr., “Polyimides” in Encyclopedia of Polymer Science and Engineering, 2
nd
Ed., John Wiley and Sons, New York, Vol. 12, 364 (1988); C. E. Sroog, Prog. Polym. Sci., 16, 591 (1991)]. Many of these polyimides can be melt processed into various useful forms such as coatings, adhesives, composite matrix resins and films. The use of anhydrides as endcapping agents to control the molecular weight of the polymer and, in turn, to make them easier to process in the molten form has also been disclosed [U.S. Pat. No. 5,147,966 (St. Clair, et al.) and U.S. Pat. No. 5,478,916 (St. Clair, et al.)].
Current technology for making preimpregnated tape (prepeg) and composites from polyimides entails the processing of the polyamic acid solution with the reinforcing fibers. These polyamic acid solutions have a high viscosity and low solids content. In general, the solutions are prepared at solid contents of 25 to 35% by weight with resulting Brookfield viscosities of 15,000 to 35,000 cp at 20° C. Consequently, the processing of these types of prepegs requires overcoming significant problems such as solvent management and good fiber wet out from the high viscosity solutions. Frequently, the resultant prepegs require residual solvent contents of 20 to 25% by weight (~2-3% water from thermal imidization reaction) for adequate tack and drape. This residual solvent must then be removed during the composite cure cycle. Typically, solvent removal is accomplished by holding the material at an intermediate drying temperature, above the boiling temperature of the solvent, for extended periods of time (i.e., one to two hours) under full vacuum, 30″ Hg. The material is then ramped to a final cure temperature to ensure complete fiber wet-out and full consolidation.
The need for a process to produce high temperature polyimides into composites with less solvent is apparent. The hazards and expense of solvent removal and recovery are critical to the composite technology. A process which utilizes significantly less solvent and results in a higher quality intermediary and end-product is key to the use of these polyimide systems in large quantities. A primary requirement for such prepegs is that they have adequate wet out, proper fiber aerial weight, proper resin content, tack, drape, and low solvent content. These parameters are critical in the manufacture of composites from prepegs. Composites manufactured from these materials are vital in any application which requires elevated temperature use with weight constraints.
It is a primary object of the present invention to provide novel film, preimpregnated tape and composites manufactured from polyimide “salt-like” solutions with enhanced flow, tack, and drape in addition to high solids content and low residual volatiles.
Another object of the present invention is to provide novel polyimide “salt-like” solutions with physical characteristics that permit processing into high-performance materials through the use of standard prepregging and composite fabrication equipment. The utilization of these novel polyimide “salt-like” solutions permits the employment of significantly less solvent and results in higher quality preimpregnated tape.
SUMMARY OF THE INVENTION
According to the present invention the forgoing and additional objects are obtained by fabricating films and preimpregnated tapes from “salt-like” solutions of high temperature polyimides. The preimpregnated tapes can then be used to make composites. The polyimide “salt-like” solutions are formed from the reaction of a dianhydride dissolved in a mixture of solvent and alcohol at room temperature. This solution is treated at 60° C. for 3 hours in order to convert the dianhydride into a diester-diacid. Phthalic acid (PA) and a diamine are added to the diester-diacid solution and the mixture is stirred for 2 hours to yield a homogenous polyimide precursor “salt-like” solution. Likewise, similar polyimide “salt-like” resins can be formed from tetraacids and diamines mixed in different solvents and alcohols.
These “salt-like” solutions have a low viscosity (5,000 to 9,700 cp) and a high solids content (50-65% by weight) and can be coated onto reinforcing fiber to produce high quality prepegs with excellent tack and drape at 12-15% residual solvent (~4-6% water from thermal imidization reaction). Composites from these prepegs are of high quality and require significantly less solvent removal. Typically, low drying temperatures and only partial vacuum are required.
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patent: 5147966 (1992-09-01), St. Clair et al.
patent: 5464928 (1995-11-01), Chang et al.
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Cano Roberto J.
Echigo Yoshiaki
Kaneshiro Hisayasu
St. Clair Terry L.
Weiser Erik S.
Hampton-Hightower P.
The United States of America as represented by the National Aero
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