Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-02-25
1995-01-03
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174260, 361760, 361762, 361767, 361768, H05K 102
Patent
active
053788591
ABSTRACT:
This application discloses a film wiring board for directly mounting an electronic parts such as an IC chip, on which a protective film having an opening can be formed in one step by a screen printing. This film wiring board has wiring patterns including connection pads and lead wires. Connection electrodes of the IC chip are connected to the connection pads via soldering bumps. Since the width of each of the lead wires is comparatively small at 10 .mu.m-30 .mu.m, the once molten solder when the connection is done is kept on the corresponding connection pad by the surface tension and is prevented from flowing from the connection pad to the corresponding lead wire. Therefore, since the opening of the protective film need not have a function for stopping the flow of the solder, there may be no problem if the opening is comparatively enlarged. Consequently, the protective film having the opening can be formed in one step by the screen printing, and then a productivity of the film wiring board may be increased and its production cost can be reduced.
REFERENCES:
patent: 4339785 (1982-07-01), Ohsawa
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4806706 (1989-02-01), Machida et al.
patent: 4860442 (1989-08-01), Ainsworth et al.
patent: 4882656 (1989-11-01), Menzies, Jr. et al.
patent: 4972050 (1990-11-01), Hammond et al.
Kuwabara Osamu
Shirasaki Tomoyuki
Casio Computer Co. Ltd.
Picard Leo P.
Thomas L.
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