Electrical resistors – Incased – embedded – or housed – Casing or housing formed on and hardened on resistor
Patent
1992-04-06
1993-10-12
Lateef, Marvin M.
Electrical resistors
Incased, embedded, or housed
Casing or housing formed on and hardened on resistor
338260, 338256, 338309, 338317, 338273, 338333, 257675, H01C 1034
Patent
active
052529444
ABSTRACT:
The film-type electrical power resistor includes a flat chip of aluminum oxide, having a resistive film screen-printed onto one of its sides. Leads are bonded to that side and electrically connected to the film, the leads being such that the chip may be cantilevered by the leads in a mold cavity before introduction of synthetic resin into the cavity, and with the lower chip surface spaced above the bottom cavity wall. A molded body is molded in the cavity to fully encapsulate the chip, film, and inner ends of the leads, there being no mold cup around the molded body. The molded body is formed of high thermal-conductivity thermosetting synthetic resin. Provided through the body is a bolthole for clamping of the resistor to an external chassis or heatsink. The space between the bottom surface of the chip and the flat bottom surface of the molded body is a heat-sinking volume formed of the high thermal-conductivity resin; and the bottom surface of such volume of resin is the bottom surface of the resistor. The stated volume does not contain any metal that is either in an electric circuit, or projects outwardly relative to the edges of the chip.
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Data Sheet No. PD-2.068A from International Rectifier 1985 Product Guide and Specification Databook.
Caddock Electronics, Inc.
Gausewitz Richard L.
Lateef Marvin M.
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