Film trimming of laminated photosensitive layer

Details Film trimming of laminated photosensitive layer Film trimming of laminated photosensitive layer

1986-01-29

1988-05-17

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156247, 156250, 430270, B32B 3100, B44C 100, G03C 190

Patent

active

047448474

ABSTRACT:
A process is disclosed for separating a series of substrate elements laminated with a supported photosensitive composition whereby the support is weakened by heating in a line pattern along abutting edges of the substrate prior to pulling the laminated substrates apart.

REFERENCES:
patent: 4075051 (1978-02-01), Brzozowski
patent: 4378264 (1983-03-01), Pilette et al.
patent: 4495014 (1985-01-01), Gebrian et al.

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