Film thickness uniformity control apparatus for in-line sputteri

Details Film thickness uniformity control apparatus for in-line sputteri Film thickness uniformity control apparatus for in-line sputteri

1990-10-12

1992-10-20

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429823, 20429825, C23C 1434

Patent

active

051567270

ABSTRACT:
A mask arrangement is located between the cathode and substrate in an in-line sputtering system. The relative shape of the mask may be changed from outside the system. Thus, film thickness uniformity can be modified and controlled without interrupting the sputtering process.

REFERENCES:
patent: 3661759 (1972-05-01), Bruce et al.
patent: 4278528 (1981-07-01), Kuehnle et al.
patent: 4294678 (1981-10-01), Kuehnle
patent: 4315960 (1982-02-01), Ohji et al.
patent: 4562093 (1985-12-01), Mario et al.
patent: 4814056 (1989-03-01), Welty

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