Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2006-01-31
2006-01-31
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Dimension
Thickness
C250S459100
Reexamination Certificate
active
06992781
ABSTRACT:
A method for measuring a relative thickness distribution of an organic thin film for use in an organic electroluminescence device comprises the steps of irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, measuring the intensity of a fluorescence produced by the organic thin film in response to the light irradiation, and obtaining a film thickness of the predetermined region from the intensity of the fluorescence. Further, an apparatus for measuring a thickness distribution for use in an organic electroluminescence device has means for irradiating a predetermined region of the organic thin film with a light including an ultraviolet light, means for measuring the intensity of a fluorescence produced by the organic thin film, and means for obtaining the film thickness of the predetermined region from the intensity of the fluorescence.
REFERENCES:
patent: 4292341 (1981-09-01), Marcuse et al.
patent: 4841156 (1989-06-01), May et al.
patent: 5001353 (1991-03-01), Odake et al.
patent: 5281819 (1994-01-01), Keffert et al.
patent: 5414506 (1995-05-01), Saisho et al.
patent: 5604581 (1997-02-01), Liu et al.
patent: 5844249 (1998-12-01), Takano et al.
patent: 5986268 (1999-11-01), Forrest et al.
patent: 6025036 (2000-02-01), McGill et al.
patent: 6252237 (2001-06-01), Ramthun et al.
patent: 6529273 (2003-03-01), Norris et al.
patent: 6594025 (2003-07-01), Forouhi et al.
patent: 2001/0046045 (2001-11-01), Dong et al.
patent: 0 336 029 (1989-10-01), None
patent: 1 180 660 (2002-02-01), None
patent: 3-252512 (1991-11-01), None
patent: 2000-294372 (2000-10-01), None
C.W. Tang, et al. “Organic Electroluminescent Diodes” Appl. Phys. Lett. 51 (12), Sep. 21, 1987, pp. 913-915.
Echigo Tadahiro
Naka Shigeki
Okada Hiroyuki
Onnagawa Hiroyoshi
Shibata Miki
Nguyen Sang H.
President of Toyama University
Toatley , Jr. Gregory J.
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