Film thickness measuring and film forming method

Details Film thickness measuring and film forming method Film thickness measuring and film forming method

1996-11-27

1998-04-14

Porta, David P.

X-ray or gamma ray systems or devices

Specific application

Diffraction, reflection, or scattering analysis

378 76, 378 89, G01N 23201

Patent

active

057402264

ABSTRACT:
A film thickness measuring method comprises the steps of measuring reflectances of X-rays on a film, extracting interference oscillations from the measured X-ray reflectances, and Fourier transforming the interference oscillations to compute a film thickness of the film, an average reflectance being given by fitting the measured X-ray reflectances to an analysis formula including a term of a product of a power function of an incident angle, which expresses attenuation of reflectances on a smooth surface of the film and an exponent function which expresses influence of roughness of the surface of the film, and a constant term expressing a background added to the product; the interference oscillations being given by using the measured X-ray reflectances and the average reflectance. The film thickness measuring method can extract interference oscillations of a reflectance curve by a method including arbitrariness and by a simple procedure.

REFERENCES:
patent: 5003569 (1991-03-01), Okada et al.
patent: 5619548 (1997-04-01), Koppel

Affiliated with

Also associated with

Rating

Film thickness measuring and film forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film thickness measuring and film forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film thickness measuring and film forming method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-644044