Film structure and electronic device housing utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...

Reexamination Certificate

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Details

C257S702000, C428S201000, C428S206000, C428S208000, C428S322200

Reexamination Certificate

active

07829996

ABSTRACT:
An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal films. The metal films are non-continuous with a total thickness of the metal films at a predetermined value. The protective film is deposited onto an upper film of the film stack.

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