Film stack having under layer for preventing pinhole defects

Details Film stack having under layer for preventing pinhole defects Film stack having under layer for preventing pinhole defects

2007-09-11

2007-09-11

Zacharia, Ramsey (Department: 1773)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

C428S422000, C428S500000, C428S702000

Reexamination Certificate

active

10880818

ABSTRACT:
A film stack and method of forming a film stack are provided in which a first film is disposed on a substrate and a second film has an inner surface disposed on the first film. The second film has a thickness smaller than a reference thickness at which the second film would begin to dewet from the substrate if the second film were disposed directly on the substrate. However, the second film is substantially free of dewetting defects because it is disposed overlying the first film which has a first Hamaker constant having a negative value with respect to the substrate.

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J. N. Israelachvili,Intermolecular and Surface Forces(London Academic Press), pp. 176-209, Chapter 11.

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