Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-07-21
2010-06-22
Sells, James (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S247000, C156S345420, C156S581000, C156S583100, C156S583200
Reexamination Certificate
active
07740728
ABSTRACT:
A film separation apparatus (100) for separating a film (110) attached to a film application surface of a wafer (120) comprises a wafer adsorption unit (31) for adsorbing the wafer with the film application surface up, a release tape supply unit (42) for supplying the release tape (3) onto the film application surface, and a heating unit (80) for pressing and heating only a part of the release tape against the wafer film at an edge of the wafer. Thus, the adhesion between the release tape and the film is increased at the particular part of the release tape. The apparatus further comprises a peeling unit (44) for separating the film from the film application surface of the wafer using a release tape with a part of the release tape having an improved adhesion as a separation starting point. Thus, the surface protective film can be easily separated from the wafer.
REFERENCES:
patent: 6129811 (2000-10-01), McKenna et al.
patent: 2001/0017189 (2001-08-01), Tsujimoto et al.
patent: 2002/0187589 (2002-12-01), Tsujimoto
patent: 2003/0092288 (2003-05-01), Yamamoto et al.
patent: 0 886 299 (1998-12-01), None
patent: 1 128 415 (2001-08-01), None
patent: 0 886 299 (2003-09-01), None
patent: 1 484 786 (2004-12-01), None
patent: 1 128 415 (2006-05-01), None
patent: 1 484 786 (2006-06-01), None
patent: 11-16862 (1999-01-01), None
patent: 2003-045904 (2003-02-01), None
patent: 2004-071687 (2004-03-01), None
patent: 2004-128147 (2004-04-01), None
patent: 2004-165570 (2004-06-01), None
patent: 1999-007148 (1999-01-01), None
patent: 2001-0097792 (2001-11-01), None
Patent Abstracts of Japan, with Machine Translation of Application, Publication No. 11-016862; Date of Publication: Jan. 22, 1999; in the name of Masaki Tsujimoto et al.
Office action, with English translation, dated Jan. 18, 2008, for corresponding Korean Patent Application No. 10-2006-0071707, indicating the relevance of KR 1999-007148.
Search Report dated Apr. 21, 2008 for corresponding European Patent Application No. 06117386.0, indicating the relevance of the cited references.
Patent Abstracts of Japan and English machine translation of JP 2003-045904 listed above.
Patent Abstracts of Japan and English machine translation of JP 2004-071687 listed above.
Patent Abstracts of Japan, Publication No. 2004128147 A, Published on Apr. 22, 2004, in the name of Yamamoto.
Patent Abstracts of Japan, Publication No. 2004165570 A, Published on Jun. 10, 2004, in the name of Yamamoto.
Christie Parker & Hale, LLP.
Sells James
Tokyo Seimitsu Co. Ltd.
LandOfFree
Film separation method and film separation apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Film separation method and film separation apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film separation method and film separation apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4208226