Film removing method and film removing agent

Details Film removing method and film removing agent Film removing method and film removing agent

1995-04-24

1997-05-27

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

134 31, 134902, 216 57, B32B 3500

Patent

active

056328478

ABSTRACT:
The method of removing a film from a substrate (wafer) comprises a step of injecting ozone (13) into an acid aqueous solution (12) (e.g., a mixed liquid of dilute hydrogen fluoride aqueous solution and dilute hydrochloric acid); and a step of bringing bubbles (18) formed by the ozone injection step into contact with a film (17) (e.g., organic or metal contaminated film) adhering on to the substrate to remove the film (17) from the substrate (16). Therefore, the organic film or metal contaminated film adhering onto the substrate surface can be removed easily and effectively. Further, the film removing agent is bubbles formed when ozone (13) is injected into an acid aqueous solution. Each bubble is composed of an inside ozone bubble and an outside acid aqueous solution bubble. Therefore, when the bubbles are brought into contact with the film, an intermediate between ozone and the film is first formed, and then the formed intermediate can be removed from the substrate by the acid aqueous solution.

REFERENCES:
patent: 4944837 (1990-07-01), Nishikawa et al.
patent: 5288333 (1994-02-01), Tanaka et al.
patent: 5370741 (1994-12-01), Bergman
patent: 5445679 (1995-08-01), Hansen et al.
patent: 5494526 (1996-02-01), Paranjpe

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