Film removing device for resin molded material

Details Film removing device for resin molded material Film removing device for resin molded material

1997-10-29

1999-08-03

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156344, 294265, B32B 3500

Patent

active

059320664

ABSTRACT:
According to a film removing device, a film-coated resin molded material having a film coated on one surface of a matrix resin is flattened by a flattening roll in a heating chamber. Further, the film-coated resin molded material is fed between a peeling roll and a feeding roll of roll type rolling means for rolling and stretching. The velocity of a peeling surface of the peeling roll is made relatively higher than the velocity of a feeding surface of the feeding roll, whereby a difference in elongation between the matrix resin and the film, and a shearing force are produced to peel the film. An applicator type supply device supplies a liquid as frictional force reducing means (e.g. water) to the peeling surface and the feeding surface. Thus, a frictional force is reduced, and stretching accompanying rolling fully works. Consequently, the film becomes easy to fracture and peel, and its peeling can be performed effectively.

REFERENCES:
patent: 5304276 (1994-04-01), MacLeod et al.
patent: 5376210 (1994-12-01), Brochu et al.
patent: 5807460 (1998-09-01), Yamamoto

Affiliated with

Also associated with

Rating

Film removing device for resin molded material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film removing device for resin molded material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film removing device for resin molded material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-846369