Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1995-05-24
1997-10-14
Warden, Robert J.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156584, B32B 3116, B32B 3118
Patent
active
056767897
ABSTRACT:
A film peeling method for peeling a film bonded to a board, one end portion of the film overhanging from one end of the board, comprises the steps of: fixing the board by adsorbing the board in a predetermined position; clamping the one end portion of the film overhanging from the board fixed in the predetermined position by a peel hand extending in parallel with the film; causing the peel hand to make an arcuate movement with the one end portion of the film clamped, the arcuate movement being made within a plane orthogonal to the board with the vicinity of a surface of the board as the center of an arc while adjusting a position of the peel hand so as to face to the center of the arc, the peel hand moving away from the board and lifting the one end portion of the film in a direction of other end of the board during the arcuate movement; moving the lifted one end portion of the film in the direction of the other end of the board with the peel hand clamping the one end portion of the film, and further forwarding the one end portion of the film out of the board at least up to such a position as to peel other end portion of the film off the board while passing over the other end of the board; and releasing the film outside the board.
REFERENCES:
patent: 4637850 (1987-01-01), Suzuki et al.
patent: 4685991 (1987-08-01), Herrmann et al.
patent: 4855012 (1989-08-01), Sumi
patent: 4956044 (1990-09-01), Watanabe et al.
patent: 5240546 (1993-08-01), Shiga
patent: 5417922 (1995-05-01), Markin et al.
patent: 5427644 (1995-06-01), Nagatsuka et al.
Dawson E. Leigh
Somar Corporation
Warden Robert J.
LandOfFree
Film peeling method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Film peeling method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film peeling method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1552334