Film pattern formation method, device and method for...

Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead

Reexamination Certificate

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Reexamination Certificate

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10848604

ABSTRACT:
A method for forming a film pattern on a substrate includes the steps of: forming banks on the substrate; and making liquid drops of functional liquid land on the substrate to dispose the liquid drops in an area partitioned by the banks, wherein a spacing between the liquid drops are determined so that the liquid drops connect together after they land on the substrate, and a position in which a liquid drop of the liquid drops which lands the closest to an end of the area is spaced from the end of the area by less than a half of the spacing between the liquid drops.

REFERENCES:
patent: 6524876 (2003-02-01), Baek et al.
patent: 6715871 (2004-04-01), Hashimoto et al.
patent: 6734029 (2004-05-01), Furusawa
patent: 0 989 778 (2000-03-01), None
patent: A 11-204529 (1999-07-01), None
patent: A 11-207959 (1999-08-01), None
patent: A 11-274671 (1999-10-01), None
patent: A 2000-216330 (2000-08-01), None
patent: A 2002-164635 (2002-06-01), None
patent: A 2003-80694 (2003-03-01), None
patent: A 2003-1336691 (2003-05-01), None
patent: 2001-0009269 (2001-02-01), None
patent: WO 99/48339 (1999-09-01), None
patent: WO 01/47045 (2001-06-01), None

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