Film-mounted circuit and method for fabricating the same

Electricity: electrical systems and devices – Miscellaneous

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29840, H05K 109

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active

048111708

ABSTRACT:
A film-mounted circuit includes a support film, metallic conductor runs formed of solderable material disposed on the support film, the conductor runs each having two ends, a contact area containing solder material electroplated on one of the ends and external terminal contacts containing solder material electroplated on the other of the ends for receiving a solder connection to external wiring, and a metallic semiconductor chip having hump-like terminal contacts each having a side with a surface area soldered to a respective one of the contact areas, the terminal contacts being formed of solderable material at least at the surface area thereof, the solderable material of the surface area of the terminal contacts forming an alloy together with the solder material of the contact areas deposited by electroplating during soldering, the alloy having an alloy ratio defined by a eutectic point, the melting point temperature of which is at least 20.degree. C. above the melting point temperature of the solder material of the external terminal contacts but below a temperature at which the semiconductor chip is thermally damaged by the soldering, and a method of fabricating the same.

REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 3680198 (1972-08-01), Wood
patent: 4259436 (1981-03-01), Tabuchi et al.
Patent Abstract of Japan, vol. 6, No. 151, Aug. 1982.
Machine Design, vol. 43, No. 1, Jan. 7, 1971, p. 28.
Publication "Constitution of Binary Alloys" by Max Hansen, 1958.

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