Film material for manufacturing film carriers having outer lead

Details Film material for manufacturing film carriers having outer lead Film material for manufacturing film carriers having outer lead

1990-11-06

1992-10-06

Hille, Rolf

H01L 2354

Patent

active

051537079

ABSTRACT:
A film material for manufacturing film carriers and its manufacturing method wherein the film material common in all may be applied with respect to the various semiconductor chips which are different in the electrode layout, because the inner lead portions for bump connection use which are required to be changed each time the electrode layout of the semiconductor chip changes are not pattern formed, and are kept as the inner lead forming portion with the whole remaining covered with the conductive metallic layer, and, the manufacturing apparatus for etching mask and model and so on have only to be one in type.

REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
patent: 4551912 (1985-11-01), Marks
patent: 4800419 (1989-01-01), Long et al.
patent: 4806503 (1989-02-01), Yoshida et al.

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