Film forming process utilizing discharge

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge

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136261, 427 39, 427 86, 42218604, C23C 1308, C23C 1100, H01L 3115

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active

044040768

ABSTRACT:
A film forming process comprising introducing gas for forming a film from an inlet part for gas into a pressure-reducible deposition chamber wherein a substrate for forming a film thereon is supported by a fixing member, at least one of said substrate and fixing member are used so as to act as a first electrode, at least one portion of the wall of said deposition chamber is employed so as to act as a second electrode, the surface of said second electrode is arranged substantially in parallel to the surface for forming a film thereon, of said substrate, and said inlet part for gas and an outlet part for gas are arranged substantially in the positional relationship of rotation symmetry; and generating a glow discharge in said deposition chamber, thereby forming a film on said substrate.

REFERENCES:
patent: 3068510 (1962-12-01), Coleman
patent: 3179618 (1979-12-01), Tanaka et al.
patent: 3471316 (1969-10-01), Manuel
patent: 3473459 (1969-10-01), Ehinger et al.
patent: 3475307 (1969-10-01), Knox et al.
patent: 3600122 (1971-08-01), Coleman
patent: 3730863 (1973-05-01), Keller
patent: 4064521 (1977-12-01), Carlson
patent: 4282265 (1981-08-01), Priestly et al.
patent: 4317844 (1982-03-01), Carlson
Robertson, J. Electrochem. Soc., vol. 122, No. 6, pp. 796-800, Jun. 1975.

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