Film forming method, film forming apparatus, pattern forming...

Details Film forming method, film forming apparatus, pattern forming... Film forming method, film forming apparatus, pattern forming...

2004-08-27

2009-10-20

Jolley, Kirsten C (Department: 1792)

Coating processes

Measuring, testing, or indicating

C427S240000, C427S350000, C427S385500, C427S425000, C427S427300, C118S665000, C118S708000, C118S712000, C118S713000, C118S052000, C118S320000, C118S321000, C118S323000, C438S758000

Reexamination Certificate

active

07604832

ABSTRACT:
There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5qγ (mm) given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5(m·sec/N).

REFERENCES:
patent: 5622747 (1997-04-01), Todd et al.
patent: 5803970 (1998-09-01), Tateyama et al.
patent: 5952050 (1999-09-01), Doan
patent: 5965200 (1999-10-01), Tateyama et al.
patent: 6062288 (2000-05-01), Tateyama
patent: 6063190 (2000-05-01), Hasebe et al.
patent: 6092937 (2000-07-01), Snodgrass et al.
patent: 6120834 (2000-09-01), Terauchi
patent: 6162745 (2000-12-01), Ito et al.
patent: 6231917 (2001-05-01), Ito et al.
patent: 6319317 (2001-11-01), Takamori
patent: 6410080 (2002-06-01), Ito
patent: 6416583 (2002-07-01), Kitano et al.
patent: 6475285 (2002-11-01), Ikegami et al.
patent: 6506453 (2003-01-01), Ema et al.
patent: 6616762 (2003-09-01), Inada et al.
patent: 6709699 (2004-03-01), Ema et al.
patent: 6766817 (2004-07-01), da Silva
patent: 6776845 (2004-08-01), Minami et al.
patent: 6918404 (2005-07-01), Dias da Silva
patent: 7066586 (2006-06-01), da Silva
patent: 1304167 (2001-07-01), None
patent: 59-92530 (1984-05-01), None
patent: 2-220428 (1990-09-01), None
patent: 2-233174 (1990-09-01), None
patent: 6-151295 (1994-05-01), None
patent: 7-321001 (1995-12-01), None
patent: 8-222502 (1996-08-01), None
patent: 8-316311 (1996-11-01), None
patent: 9-92134 (1997-04-01), None
patent: 09-276781 (1997-10-01), None
patent: 2842909 (1998-10-01), None
patent: 11-243043 (1999-09-01), None
patent: 2000-77307 (2000-03-01), None
patent: 2000-77326 (2000-03-01), None
patent: 2000-79366 (2000-03-01), None
patent: 2000-188251 (2000-07-01), None
patent: 2001-148338 (2001-05-01), None
patent: 2001-168021 (2001-06-01), None
patent: 2001-170546 (2001-06-01), None
patent: 2001-176765 (2001-06-01), None
patent: 2001-176781 (2001-06-01), None
patent: 2001-176786 (2001-06-01), None
patent: 2001-232250 (2001-08-01), None
patent: 2001-232269 (2001-08-01), None
patent: 2001-237179 (2001-08-01), None
patent: 2001-239198 (2001-09-01), None
patent: 2001-291660 (2001-10-01), None
patent: 2001-310155 (2001-11-01), None
Notification of Reasons for Rejection from the Japanese Patent Office, dated Oct. 31, 2006, in counterpart Japanese Patent Application No. 2004-367913.
First Notification of Reasons for Rejection, issued by Chinese Patent Office, dated Feb. 4, 2005, in Chinese Patent Application No. 03102108.5, and English-language translation thereof.
Shinichi Ito, “Liquid Film Forming Method and Solid Film Forming Method”, U.S. Appl. No. 10/202,657, filed Jul. 25, 2002.
Nobuhide Yamada et al., “Method of Forming Coating Film, Method of Manufacturing Semiconductor Device and Coating Solution”, U.S. Appl. No. 10/112,951, filed Apr. 2, 2002.
Shinichi Ito et al., “Film Formation Method, Semiconductor Element and Method Thereof, and Method of Manufacturing a Disk-Shaped Storage Medium”, U.S. Appl. No. 09/842,403, filed Apr. 26, 2001.
Tatsuhiko Ema et al., “Film Forming Method, Film-Forming Apparatus and Liquid Film Drying Apparatus”, U.S. Appl. No. 09/961,288, filed Sep. 25, 2001.
Notification of Reasons for Rejection issued by the Japanese Patent Office, mailed Oct. 19, 2004, in Japanese Patent Application No. 2002-022382, and English-language translation thereof.
Notification of Reasons for Rejection issued by the Japanese Patent Office, mailed Oct. 19, 2004, in Japanese Patent Application No. 2002-031911, and English-language translation thereof.
Office Action mailed Dec. 12, 2008, from the State Intellectual Property Office of the People's Republic of China in counterpart Chinese Patent Application No. 2006100720417, and English language translation thereof.

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