Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1989-03-24
1991-02-26
Silverman, Stanley
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 39, 427 40, 427 41, 427299, 427307, 427322, B05D 306
Patent
active
049960768
ABSTRACT:
The invention concerns a method for forming a coating with excellent adhesion, water resistance and appearance which comprises the combination of steps of applying on the hydrophobic surfaces having a surface tension of 35 dyne/cm or less of a substrate a dry surface treatment selected from vacuum plasma treatment, corona discharge treatment and ozonization treatment, coating thus treated surfaces with a dispersion type aqueous coating composition comprising an aqueous varnish of at least one aqueous resin whose 1 wt % deionized water solution has a surface tension of 51 dyne/cm or less and which has a water tolerance of 4 or more, and water insoluble resin uniformly dispersed in fine particles in said varnish, the water insoluble resin having a SP value which is 1.0 to 2.2 lower than that of said aqueous resin, and baking the coating. The present method is specifically useful in the coating of automobile bodies, appliances and other high-quality products.
REFERENCES:
patent: 4534995 (1985-08-01), Pocock et al.
patent: 4678681 (1987-07-01), Obayashi et al.
Konishi Sakuichi
Kuwano Koichi
Nagahata Satoru
Nakaya Toshiharu
Nippon Paint Co. Ltd.
Silverman Stanley
LandOfFree
Film forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Film forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film forming method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-293315