Film forming apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118719, C23C 1434

Patent

active

054826071

ABSTRACT:
A film forming apparatus includes a film forming chamber in which a film is formed on a substrate at a film forming position, a plurality of load lock chambers provided on the film forming chamber through gate valves respectively, a plurality of pivots provided in the film forming chamber correspondingly to the respective load lock chambers, and carrying arms supported by the pivots respectively so as to move the substrate from any one of the load lock chambers to the film forming position and contrariwise from the film forming position to any one of the load lock chambers.

REFERENCES:
patent: 4388034 (1983-06-01), Takahashi
patent: 4595483 (1986-06-01), Mahler
patent: 4820106 (1989-04-01), Walde et al.
patent: 4857160 (1989-08-01), Landau et al.
patent: 4886592 (1989-12-01), Anderle et al.
patent: 4927484 (1990-05-01), Mitomi
patent: 5019233 (1991-05-01), Blake et al.
patent: 5061356 (1991-10-01), Tanaka et al.
patent: 5186594 (1993-02-01), Toshima et al.
patent: 5217501 (1993-06-01), Fuse et al.
patent: 5223001 (1993-06-01), Saeki

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Film forming apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film forming apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film forming apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1300372

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.