Film forming apparatus

Details Film forming apparatus Film forming apparatus

2011-06-28

2011-06-28

McDonald, Rodney G (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298110, C204S298280, C204S298150

Reexamination Certificate

active

07967961

ABSTRACT:
There is provided a film forming apparatus which is capable of forming a film on both surfaces of a substrate by sputtering continuously with high efficiency by restraining a rise in temperature of the substrate to a predetermined value or higher.In a film forming chamber2the pressure of which is controlled, while a rotating drum7is rotated by the driving of a drive motor8, a film is formed on the top surface of a substrate12on a substrate tray13held on a substrate holder10by cathodes17aand17bfor outer surface to which a d.c. voltage or an a.c. voltage or a high-frequency voltage is applied, and also a film is formed on the back surface of the substrate12on the substrate tray13held on the substrate holder10by cathodes14aand14bfor inner surface to which a d.c. voltage or an a.c. voltage or a high-frequency voltage is applied, by which a high-quality film is formed on both surfaces of the substrate12by sputtering continuously with high efficiency by restraining a rise in temperature of the substrate to a predetermined value or higher.

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