Film forming apparatus

Coating apparatus – Gas or vapor deposition – With treating means

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118730, C23C 1646, C23C 1652

Patent

active

048585580

ABSTRACT:
A film forming apparatus comprises a reaction furnace having a reaction chamber therein, injection nozzles for introducing a reactive fluid, provided on the reaction furnace, a discharge nozzle for discharging a reactive fluid, provided on the reaction furnace, and a pair of susceptors located in almost vertical position in the reaction chamber and having facing sides separated by a specified distance. The susceptors include a plurality of depressions formed in the respective facing sides thereof for holding a plurality of silicon wafers. The paired susceptors are rotated in mutually opposite directions.

REFERENCES:
patent: 3594227 (1971-07-01), Oswald
patent: 4597986 (1986-07-01), Scapple et al.
patent: 4632060 (1986-12-01), Goto et al.
patent: 4694779 (1987-09-01), Hammond et al.
Patent Abstracts of Japan, vol. 8, No. 138 (C-231)[1575] Jun. 27, 1984; JP-A-59-50092 (Toshiba Kikai K.K.) Mar. 22, 1984.
Patent Abtracts of Japan, vol. 3, No. 86 (E-125), Jul. 24, 1979, p. 50E 125; JP-A-54-64977 (Nippon Denki K.K.) May 25, 1979.

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