Film formation method and orientation film formation method

Coating processes – Electrical product produced

Reexamination Certificate

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Reexamination Certificate

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07575774

ABSTRACT:
In a film formation method, a droplet discharge unit discharges droplets of a functional liquid material on a substrate as the droplet discharge unit is moved with respect to the substrate to form a liquid film on the substrate. The film formation method includes discharging a plurality of first droplets onto a plurality of first positions on the substrate with the first positions being arranged so that the first droplets do not touch each other on the substrate, discharging a plurality of second droplets onto a plurality of second positions on the substrate with the second positions being disposed between the first droplets that were discharged on the substrate; and causing the second droplets to touch a plurality of adjacent ones of the first droplets to form the liquid film.

REFERENCES:
patent: 6599582 (2003-07-01), Kiguchi et al.
patent: 6810814 (2004-11-01), Hasei
patent: 7438944 (2008-10-01), Masuda
patent: 2007/0046718 (2007-03-01), Shintate et al.
patent: 2005-000721 (2005-01-01), None
patent: 2005-013877 (2005-01-01), None
patent: 2005-028314 (2005-02-01), None
patent: 3705281 (2005-08-01), None
patent: 2005-305337 (2005-11-01), None

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