Film for circuit board

Details Film for circuit board Film for circuit board

2006-05-02

2006-05-02

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S336000, C428S344000, C428S3550RA, C428S413000, C428S414000, C428S418000, C428S901000, C427S307000, C427S386000, C523S427000, C523S428000, C523S433000, C523S435000

Reexamination Certificate

active

07037586

ABSTRACT:
The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film.A layer: a heat-resistant resin layer with a thickness of from 2 to 250 μm which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, andB layer: a roughenable cured resin layer with a thickness of from 5 to 20 μm which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.

REFERENCES:
patent: 6124023 (2000-09-01), Furuta et al.
patent: 6403221 (2002-06-01), Nakamura et al.
patent: 6805958 (2004-10-01), Nakamura et al.
patent: 1293218 (2001-05-01), None

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